switch model PCB Rectifier with timer and ampere hour meter
Plating on a PCB refers to the electrochemical process by which a metal is deposited onto the surface of the circuit board, and inside the plated through-holes. The most common plated metal in PCB fabrication is copper.Generally, a PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto board, connecting different components on the PCB, such as transistors, resistors, and integrated circuits.
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Application
Different volt and current has different applications
Specification
SPECIFICATIONS FOR GKD(M)(H)12-100CVC | |||
Input AC | 380V±10% | 3phase | 50/60Hz |
Output DC | Volt | 0~12V Adjustable | |
Current | 0~250A Adjustable | ||
Power | 3KW | ||
Efficiency | >85% | ||
Ripple | <5% | ||
Switching Frequency | 20KHz | ||
Protection | Short circuit protection Overheating protection Phase lack protection Input over/low voltage protection |
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Working Condition (Temperature) |
-10℃~50℃ | Control mode | Panel control Remote control |
Net weight | 25kg | Working mode | Constant Voltage(CV) Constant Current(CC) |
Dimension(mm) | 520*395*165mm | Cooling way | Air cooling |
1. 0~10V, 4~20mA,PLC,Timer, Ampere-minute/hour counter, HMI can be provided
2. Control mode: Local control or Remote control(the length of cable is determined by customers)
3. Japan IGBT(the default choice) or Germany IGBT are adopted
4. After being phosphated, galvanized and plastic sprayed, the chassis has excellent corrosion resistence function
5. Easy to operate and repaire
A,Electroless copper plating process:
1. The main purpose of the pretreatment step:
One. Ensure the continuous integrity of electroless copper plating;
2. Ensure the bonding force of chemical copper and substrate copper foil;
3. Ensure the bonding force between chemical copper and inner copper foil;
4. Ensure the bonding force between the chemically deposited copper layer and the non-conductive substrate.
(The above is a brief description of electroless copper plating pretreatment.)
B,The typical pretreatment procedures for electroless copper plating are as follows:
Degreasing:
i. Purpose of degreasing:
① Remove grease from copper foil and holes;
② Remove the dirt of copper foil and holes;
③ It helps to remove the pollution on the surface of copper foil and is beneficial to the subsequent heat treatment;
④ Easy to deal with the resin stains produced by drilling;
⑤ Remove the burr from the defect hole;,
C, Some key elements in the degreasing process:
① How to choose the appropriate degreaser type;
② Working temperature of oil remover;
③ Degreaser concentration;
④ Impregnation time of degreasing agent;
⑤ Mechanical stirring in the skimmer;
⑥ Cleaning points with reduced degreasing effect;
⑦ Cleaning effect after degreasing.
(In the above cleaning operations, temperature is a key factor. Many degreasing agents have a minimum temperature limit.)
D ,Some factors may affect washing:
① Washing temperature should be above 60F;
② Air stirring;
③ The spraying effect is better;
④ There is enough fresh water to replace the whole washing process in time
How to install rectifier
This is installation way for remote control rectifier. Not only this way.
1. To connect copper bar with bath/tank
2. To ensure power supply/rectifier is grounded
3. To ensure there is enough water for water cooling type power supply/rectifier
4. We advice that all rectifiers should be isolated to increase of its life.
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